(1) The thermal design of the module is such that the thermal resistance of the module in any of the above heat transfer paths is sufficiently low to ensure that the temperature of the component does not exceed the specified value, and the interface temperature, that is, the surface temperature of the heat sink or the guide rail is controlled to be between 0 ° C and 60 ° C. There are two types of problems in the thermal design of the module: design according to the internal requirements of the module, including interface temperature, power consumption and allowable temperature of the components; according to the system environment, package, single or combined module power consumption requirements, etc. The system is designed for thermal.
(2) Thermal design inside the module. In order to meet the reliability requirements of electronic modules, the design must ensure that the module is at maximum power consumption and at its rated interface temperature, so that the temperature of all components is lower than the critical temperature of the component (ie, than the rating specified in the relevant specifications). 100% lower temperature of 20 ° C). The transient temperature of the component (referred to as the rating) can be regarded as a safety factor. When the temperature of the heat sink and the guide rail reaches 80 ° C (20 ° C higher than the highest interface temperature), the temperature of all components should be lower than or equal to the component. Transient critical temperature.